Patent Assignment Details
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| Reel/Frame: | 014279/0151 | |
| Pages: | 4 |
| | Recorded: | 01/22/2004 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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12/02/2008
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Application #:
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10725933
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Filing Dt:
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12/03/2003
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Publication #:
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Pub Dt:
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06/09/2005
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Title:
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FAN OUT TYPE WAFER LEVEL PACKAGE STRUCTURE AND METHOD OF THE SAME
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Assignee
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| NO. 65, GUANGFU N. RD., HUKOU SHIANG |
| HSINCHU, TAIWAN 303, R.O.C. |
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Correspondence name and address
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NATH & ASSOCIATES PLLC
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GARY M. NATH
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1030 15H STREET, N.W. B 6TH FLOOR
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WASHINGTON, DC 20005
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