Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 016164/0152 | |
| Pages: | 2 |
| | Recorded: | 01/21/2005 | | |
| Attorney Dkt #: | 3183-103 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
2
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Patent #:
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Issue Dt:
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05/28/2002
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Application #:
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09745933
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Filing Dt:
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12/26/2000
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Publication #:
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Pub Dt:
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05/10/2001
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Title:
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METHOD FOR IMPROVING THE LIQUID DISPENSING OF IC PACKAGES
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Patent #:
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Issue Dt:
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12/10/2002
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Application #:
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10036524
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Filing Dt:
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01/07/2002
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Title:
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PACKAGING PROCESS FOR WAFER LEVEL IC DEVICE
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Assignee
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| NO. 1, R & D RD. 1 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN R.O.C. |
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Correspondence name and address
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TROXELL LAW OFFICE PLLC
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5205 LEESBURG PIKE, SUITE 1404
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FALLS CHURCH, VA 22041
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