Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 050762/0154 | |
| Pages: | 6 |
| | Recorded: | 10/18/2019 | | |
| Attorney Dkt #: | MAZ PATENT 1.3 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
6
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Patent #:
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Issue Dt:
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03/15/2005
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Application #:
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10767309
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Filing Dt:
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01/29/2004
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Publication #:
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Pub Dt:
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09/23/2004
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Title:
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PACKAGE FOR INTEGRATED CIRCUIT DIE
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Patent #:
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Issue Dt:
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05/30/2006
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Application #:
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10920660
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Filing Dt:
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08/18/2004
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Publication #:
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Pub Dt:
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01/20/2005
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Title:
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FLANGE FOR INTEGRATED CIRCUIT PACKAGE
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Patent #:
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Issue Dt:
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09/28/2010
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Application #:
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11146856
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Filing Dt:
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06/07/2005
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Publication #:
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Pub Dt:
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12/03/2009
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Title:
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ULTRA HIGH-TEMPERATURE PLASTIC PACKAGE AND METHOD OF MANUFACTURE
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Patent #:
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Issue Dt:
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03/16/2010
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Application #:
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11983813
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Filing Dt:
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11/09/2007
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Publication #:
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Pub Dt:
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06/05/2008
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Title:
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MICROCIRCUIT PACKAGE HAVING DUCTILE LAYER
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Patent #:
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Issue Dt:
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10/18/2011
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Application #:
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12950528
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Filing Dt:
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11/19/2010
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Publication #:
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Pub Dt:
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03/17/2011
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Title:
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PLASTIC ELECTRONIC COMPONENT PACKAGE
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Patent #:
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Issue Dt:
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11/20/2012
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Application #:
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13348934
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Filing Dt:
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01/12/2012
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Title:
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MICROCIRCUIT PACKAGE HAVING DUCTILE LAYER
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Assignee
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| 10-M COMMERCE WAY |
| WOBURN, MASSACHUSETTS 01801 |
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Correspondence name and address
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PRETI FLAHERTY BELIVEAU & PACHIOS LLP
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60 STATE STREET
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SUITE 1100
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BOSTON, MA 02109
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