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Reel/Frame:051407/0157   Pages: 2
Recorded: 01/03/2020
Attorney Dkt #:TSMCP665USC
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
11/09/2021
Application #:
16733341
Filing Dt:
01/03/2020
Publication #:
Pub Dt:
05/07/2020
Title:
INTEGRATED CIRCUIT PACKAGE ASSEMBLY
Assignor
1
Exec Dt:
02/15/2012
Assignee
1
NO. 8, LI-HSIN RD. 6
HSIN-CHU SCIENCE PARK
HSIN-CHU, TAIWAN 300-77
Correspondence name and address
ESCHWEILER & POTASHNIK, LLC
ROSETTA CENTER
629 EUCLID AVE., SUITE 1000
CLEVELAND, OH 44114

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