Patent Assignment Details
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Reel/Frame: | 051407/0157 | |
| Pages: | 2 |
| | Recorded: | 01/03/2020 | | |
Attorney Dkt #: | TSMCP665USC |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/09/2021
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Application #:
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16733341
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Filing Dt:
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01/03/2020
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Publication #:
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Pub Dt:
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05/07/2020
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Title:
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INTEGRATED CIRCUIT PACKAGE ASSEMBLY
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Assignee
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NO. 8, LI-HSIN RD. 6 |
HSIN-CHU SCIENCE PARK |
HSIN-CHU, TAIWAN 300-77 |
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Correspondence name and address
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ESCHWEILER & POTASHNIK, LLC
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ROSETTA CENTER
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629 EUCLID AVE., SUITE 1000
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CLEVELAND, OH 44114
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10/31/2024 07:17 PM
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