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Reel/Frame:039231/0159   Pages: 5
Recorded: 07/22/2016
Attorney Dkt #:70027-1354
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
06/16/2015
Application #:
13589018
Filing Dt:
08/17/2012
Publication #:
Pub Dt:
12/06/2012
Title:
EXPOSED INTERCONNECT FOR A PACKAGE ON PACKAGE SYSTEM
Assignors
1
Exec Dt:
08/08/2008
2
Exec Dt:
08/08/2008
3
Exec Dt:
08/08/2008
Assignee
1
10 ANG MO KIO STREET 65
#05-17/20 TECHPOINT
SINGAPORE, SINGAPORE 569059
Correspondence name and address
WONG & REES LLP
4677 OLD IRONSIDES DRIVE
SUITE 370
SANTA CLARA, CA 95054

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