Total properties:
316
Page
1
of
4
Pages:
1 2 3 4
|
|
Patent #:
|
|
Issue Dt:
|
04/09/2002
|
Application #:
|
09567466
|
Filing Dt:
|
05/09/2000
|
Title:
|
ENCAPSULATED METAL STRUCTURES FOR SEMICONDUCTOR DEVICES AND MIM CAPACITORS INCLUDING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
01/07/2003
|
Application #:
|
09599484
|
Filing Dt:
|
06/23/2000
|
Title:
|
FULLY ENCAPSULATED DAMASCENE GATES FOR GIGABIT DRAMS
|
|
|
Patent #:
|
|
Issue Dt:
|
07/22/2003
|
Application #:
|
10034862
|
Filing Dt:
|
12/28/2001
|
Publication #:
|
|
Pub Dt:
|
06/06/2002
| | | | |
Title:
|
ENCAPSULATED METAL STRUCTURES FOR SEMICONDUCTOR DEVICES AND MIM CAPACITORS INCLUDING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
06/29/2004
|
Application #:
|
10409010
|
Filing Dt:
|
04/07/2003
|
Publication #:
|
|
Pub Dt:
|
11/13/2003
| | | | |
Title:
|
ENCAPSULATED METAL STRUCTURES FOR SEMICONDUCTOR DEVICES AND MIM CAPACITORS INCLUDING THE SAME
|
|
|
Patent #:
|
|
Issue Dt:
|
11/30/2004
|
Application #:
|
10757214
|
Filing Dt:
|
01/14/2004
|
Publication #:
|
|
Pub Dt:
|
07/29/2004
| | | | |
Title:
|
METHOD OF FABRICATING MIM CAPACITOR WITH THE ENCAPSULATED METAL STRUCTURE SERVING AS THE LOWER PLATE
|
|
|
Patent #:
|
|
Issue Dt:
|
04/21/2009
|
Application #:
|
11380695
|
Filing Dt:
|
04/28/2006
|
Publication #:
|
|
Pub Dt:
|
11/01/2007
| | | | |
Title:
|
CMOS STRUCTURES AND METHODS USING SELF-ALIGNED DUAL STRESSED LAYERS
|
|
|
Patent #:
|
|
Issue Dt:
|
12/02/2014
|
Application #:
|
11757792
|
Filing Dt:
|
06/04/2007
|
Publication #:
|
|
Pub Dt:
|
11/01/2007
| | | | |
Title:
|
CMOS STRUCTURES AND METHODS FOR IMPROVING YIELD
|
|
|
Patent #:
|
|
Issue Dt:
|
10/26/2010
|
Application #:
|
11870577
|
Filing Dt:
|
10/11/2007
|
Publication #:
|
|
Pub Dt:
|
04/16/2009
| | | | |
Title:
|
METHOD OF PATTERNING MULTILAYER METAL GATE STRUCTURES FOR CMOS DEVICES
|
|
|
Patent #:
|
|
Issue Dt:
|
03/01/2011
|
Application #:
|
11924699
|
Filing Dt:
|
10/26/2007
|
Publication #:
|
|
Pub Dt:
|
04/30/2009
| | | | |
Title:
|
SEMICONDUCTOR FIN BASED NONVOLATILE MEMORY DEVICE AND METHOD FOR FABRICATION THEREOF
|
|
|
Patent #:
|
|
Issue Dt:
|
07/24/2012
|
Application #:
|
12490353
|
Filing Dt:
|
06/24/2009
|
Publication #:
|
|
Pub Dt:
|
12/30/2010
| | | | |
Title:
|
METHOD FOR REMOVING THRESHOLD VOLTAGE ADJUSTING LAYER WITH EXTERNAL ACID DIFFUSION PROCESS
|
|
|
Patent #:
|
|
Issue Dt:
|
01/31/2012
|
Application #:
|
12500107
|
Filing Dt:
|
07/09/2009
|
Publication #:
|
|
Pub Dt:
|
01/13/2011
| | | | |
Title:
|
INDUCING STRESS IN CMOS DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
04/01/2014
|
Application #:
|
12553523
|
Filing Dt:
|
09/03/2009
|
Publication #:
|
|
Pub Dt:
|
03/03/2011
| | | | |
Title:
|
STRUCTURES, METHODS AND APPLICATIONS FOR ELECTRICAL PULSE ANNEAL PROCESSES
|
|
|
Patent #:
|
|
Issue Dt:
|
07/31/2012
|
Application #:
|
12563195
|
Filing Dt:
|
09/21/2009
|
Publication #:
|
|
Pub Dt:
|
03/24/2011
| | | | |
Title:
|
INTEGRATED CIRCUIT DEVICE WITH SERIES-CONNECTED FIELD EFFECT TRANSISTORS AND INTEGRATED VOLTAGE EQUALIZATION AND METHOD OF FORMING THE DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
07/31/2012
|
Application #:
|
12571483
|
Filing Dt:
|
10/01/2009
|
Publication #:
|
|
Pub Dt:
|
04/07/2011
| | | | |
Title:
|
METHOD TO IMPROVE WET ETCH BUDGET IN FEOL INTEGRATION
|
|
|
Patent #:
|
|
Issue Dt:
|
10/16/2012
|
Application #:
|
12608363
|
Filing Dt:
|
10/29/2009
|
Publication #:
|
|
Pub Dt:
|
05/05/2011
| | | | |
Title:
|
EDGE PROTECTION SEAL FOR BONDED SUBSTRATES
|
|
|
Patent #:
|
|
Issue Dt:
|
04/09/2013
|
Application #:
|
12687282
|
Filing Dt:
|
01/14/2010
|
Publication #:
|
|
Pub Dt:
|
07/14/2011
| | | | |
Title:
|
THREE DIMENSIONAL INTEGRATION AND METHODS OF THROUGH SILICON VIA CREATION
|
|
|
Patent #:
|
|
Issue Dt:
|
12/25/2012
|
Application #:
|
12897826
|
Filing Dt:
|
10/05/2010
|
Publication #:
|
|
Pub Dt:
|
04/05/2012
| | | | |
Title:
|
DIMENSIONALLY DECOUPLED BALL LIMITING METALURGY
|
|
|
Patent #:
|
|
Issue Dt:
|
06/17/2014
|
Application #:
|
13015638
|
Filing Dt:
|
01/28/2011
|
Publication #:
|
|
Pub Dt:
|
08/02/2012
| | | | |
Title:
|
REDUCTION OF EDGE CHIPPING DURING WAFER HANDLING
|
|
|
Patent #:
|
|
Issue Dt:
|
02/18/2014
|
Application #:
|
13039678
|
Filing Dt:
|
03/03/2011
|
Publication #:
|
|
Pub Dt:
|
09/06/2012
| | | | |
Title:
|
TWO-STEP SILICIDE FORMATION
|
|
|
Patent #:
|
|
Issue Dt:
|
09/24/2013
|
Application #:
|
13084594
|
Filing Dt:
|
04/12/2011
|
Publication #:
|
|
Pub Dt:
|
10/18/2012
| | | | |
Title:
|
MINIMIZING LEAKAGE CURRENT AND JUNCTION CAPACITANCE IN CMOS TRANSISTORS BY UTILIZING DIELECTRIC SPACERS
|
|
|
Patent #:
|
|
Issue Dt:
|
05/07/2013
|
Application #:
|
13151646
|
Filing Dt:
|
06/02/2011
|
Publication #:
|
|
Pub Dt:
|
12/06/2012
| | | | |
Title:
|
CONVERTING METAL MASK TO METAL-OXIDE ETCH STOP LAYER AND RELATED SEMICONDUCTOR STRUCTURE
|
|
|
Patent #:
|
|
Issue Dt:
|
07/23/2013
|
Application #:
|
13232085
|
Filing Dt:
|
09/14/2011
|
Publication #:
|
|
Pub Dt:
|
03/14/2013
| | | | |
Title:
|
MICROSTRUCTURE MODIFICATION IN COPPER INTERCONNECT STRUCTURES
|
|
|
Patent #:
|
|
Issue Dt:
|
05/01/2012
|
Application #:
|
13242380
|
Filing Dt:
|
09/23/2011
|
Publication #:
|
|
Pub Dt:
|
01/12/2012
| | | | |
Title:
|
STRESS-INDUCED CMOS DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
02/25/2014
|
Application #:
|
13275352
|
Filing Dt:
|
10/18/2011
|
Publication #:
|
|
Pub Dt:
|
04/18/2013
| | | | |
Title:
|
INTERCONNECT STRUCTURE WITH AN ELECTROMIGRATION AND STRESS MIGRATION ENHANCEMENT LINER
|
|
|
Patent #:
|
|
Issue Dt:
|
12/23/2014
|
Application #:
|
13275729
|
Filing Dt:
|
10/18/2011
|
Publication #:
|
|
Pub Dt:
|
04/18/2013
| | | | |
Title:
|
SHALLOW TRENCH ISOLATION STRUCTURE HAVING A NITRIDE PLUG
|
|
|
Patent #:
|
|
Issue Dt:
|
01/20/2015
|
Application #:
|
13333688
|
Filing Dt:
|
12/21/2011
|
Publication #:
|
|
Pub Dt:
|
06/27/2013
| | | | |
Title:
|
ROBOTIC DEVICE FOR SUBSTRATE TRANSFER APPLICATIONS
|
|
|
Patent #:
|
|
Issue Dt:
|
11/04/2014
|
Application #:
|
13352151
|
Filing Dt:
|
01/17/2012
|
Publication #:
|
|
Pub Dt:
|
07/26/2012
| | | | |
Title:
|
INTEGRATED DEVICE WITH DEFINED HEAT FLOW
|
|
|
Patent #:
|
|
Issue Dt:
|
02/24/2015
|
Application #:
|
13352655
|
Filing Dt:
|
01/18/2012
|
Publication #:
|
|
Pub Dt:
|
07/18/2013
| | | | |
Title:
|
MULTILAYER MIM CAPACITOR
|
|
|
Patent #:
|
|
Issue Dt:
|
02/04/2014
|
Application #:
|
13358792
|
Filing Dt:
|
01/26/2012
|
Publication #:
|
|
Pub Dt:
|
08/01/2013
| | | | |
Title:
|
ON-CHIP RADIAL CAVITY POWER DIVIDER/COMBINER
|
|
|
Patent #:
|
|
Issue Dt:
|
02/03/2015
|
Application #:
|
13367725
|
Filing Dt:
|
02/07/2012
|
Publication #:
|
|
Pub Dt:
|
08/08/2013
| | | | |
Title:
|
REPLACEMENT-GATE FINFET STRUCTURE AND PROCESS
|
|
|
Patent #:
|
|
Issue Dt:
|
03/25/2014
|
Application #:
|
13422138
|
Filing Dt:
|
03/16/2012
|
Publication #:
|
|
Pub Dt:
|
07/12/2012
| | | | |
Title:
|
METHOD TO IMPROVE WET ETCH BUDGET IN FEOL INTEGRATION
|
|
|
Patent #:
|
|
Issue Dt:
|
10/29/2013
|
Application #:
|
13422415
|
Filing Dt:
|
03/16/2012
|
Publication #:
|
|
Pub Dt:
|
07/26/2012
| | | | |
Title:
|
THREE DIMENSIONAL INTEGRATION AND METHODS OF THROUGH SILICON VIA CREATION
|
|
|
Patent #:
|
|
Issue Dt:
|
07/23/2013
|
Application #:
|
13422445
|
Filing Dt:
|
03/16/2012
|
Publication #:
|
|
Pub Dt:
|
07/26/2012
| | | | |
Title:
|
THREE DIMENSIONAL INTEGRATION AND METHODS OF THROUGH SILICON VIA CREATION
|
|
|
Patent #:
|
|
Issue Dt:
|
01/26/2016
|
Application #:
|
13443963
|
Filing Dt:
|
04/11/2012
|
Publication #:
|
|
Pub Dt:
|
10/17/2013
| | | | |
Title:
|
NON-BRIDGING CONTACT VIA STRUCTURES IN PROXIMITY
|
|
|
Patent #:
|
|
Issue Dt:
|
08/13/2013
|
Application #:
|
13455176
|
Filing Dt:
|
04/25/2012
|
Publication #:
|
|
Pub Dt:
|
08/16/2012
| | | | |
Title:
|
INTEGRATED CIRCUIT DEVICE WITH SERIES-CONNECTED FIELD EFFECT TRANSISTORS AND INTEGRATED VOLTAGE EQUALIZATION AND METHOD OF FORMING THE DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
07/29/2014
|
Application #:
|
13525823
|
Filing Dt:
|
06/18/2012
|
Publication #:
|
|
Pub Dt:
|
12/19/2013
| | | | |
Title:
|
SIDEWALLS OF ELECTROPLATED COPPER INTERCONNECTS
|
|
|
Patent #:
|
|
Issue Dt:
|
05/05/2015
|
Application #:
|
13532311
|
Filing Dt:
|
06/25/2012
|
Publication #:
|
|
Pub Dt:
|
12/26/2013
| | | | |
Title:
|
FinFET with Body Contact
|
|
|
Patent #:
|
|
Issue Dt:
|
03/25/2014
|
Application #:
|
13556369
|
Filing Dt:
|
07/24/2012
|
Publication #:
|
|
Pub Dt:
|
11/15/2012
| | | | |
Title:
|
EDGE PROTECTION SEAL FOR BONDED SUBSTRATES
|
|
|
Patent #:
|
|
Issue Dt:
|
03/03/2015
|
Application #:
|
13561122
|
Filing Dt:
|
07/30/2012
|
Publication #:
|
|
Pub Dt:
|
01/30/2014
| | | | |
Title:
|
NON-LITHOGRAPHIC LINE PATTERN FORMATION
|
|
|
Patent #:
|
|
Issue Dt:
|
06/09/2015
|
Application #:
|
13561133
|
Filing Dt:
|
07/30/2012
|
Publication #:
|
|
Pub Dt:
|
01/30/2014
| | | | |
Title:
|
NON-LITHOGRAPHIC HOLE PATTERN FORMATION
|
|
|
Patent #:
|
|
Issue Dt:
|
12/22/2015
|
Application #:
|
13627162
|
Filing Dt:
|
09/26/2012
|
Publication #:
|
|
Pub Dt:
|
03/27/2014
| | | | |
Title:
|
SEMICONDUCTOR STRUCTURE WITH INTEGRATED PASSIVE STRUCTURES
|
|
|
Patent #:
|
|
Issue Dt:
|
11/25/2014
|
Application #:
|
13705652
|
Filing Dt:
|
12/05/2012
|
Publication #:
|
|
Pub Dt:
|
06/05/2014
| | | | |
Title:
|
IMPLEMENTING ENHANCED POWER SUPPLY DISTRIBUTION AND DECOUPLING UTILIZING TSV EXCLUSION ZONE
|
|
|
Patent #:
|
|
Issue Dt:
|
07/14/2015
|
Application #:
|
13732525
|
Filing Dt:
|
01/02/2013
|
Publication #:
|
|
Pub Dt:
|
07/03/2014
| | | | |
Title:
|
SIGNAL PATH OF A MULTIPLE-PATTERNED SEMICONDUCTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
01/14/2014
|
Application #:
|
13767088
|
Filing Dt:
|
02/14/2013
|
Publication #:
|
|
Pub Dt:
|
06/20/2013
| | | | |
Title:
|
TWO-STEP SILICIDE FORMATION
|
|
|
Patent #:
|
|
Issue Dt:
|
08/19/2014
|
Application #:
|
13774136
|
Filing Dt:
|
02/22/2013
|
Publication #:
|
|
Pub Dt:
|
06/27/2013
| | | | |
Title:
|
REDUCTION OF EDGE CHIPPING DURING WAFER HANDLING
|
|
|
Patent #:
|
|
Issue Dt:
|
07/08/2014
|
Application #:
|
13780854
|
Filing Dt:
|
02/28/2013
|
Publication #:
|
|
Pub Dt:
|
07/04/2013
| | | | |
Title:
|
EDGE PROTECTION SEAL FOR BONDED SUBSTRATES
|
|
|
Patent #:
|
|
Issue Dt:
|
04/28/2015
|
Application #:
|
13787948
|
Filing Dt:
|
03/07/2013
|
Publication #:
|
|
Pub Dt:
|
07/03/2014
| | | | |
Title:
|
SIGNAL PATH OF A MULTIPLE-PATTERNED SEMICONDUCTOR DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
10/13/2015
|
Application #:
|
13840880
|
Filing Dt:
|
03/15/2013
|
Publication #:
|
|
Pub Dt:
|
09/18/2014
| | | | |
Title:
|
METHODS OF REDUCING DEFECTS IN DIRECTED SELF-ASSEMBLED STRUCTURES
|
|
|
Patent #:
|
|
Issue Dt:
|
05/26/2015
|
Application #:
|
13847724
|
Filing Dt:
|
03/20/2013
|
Publication #:
|
|
Pub Dt:
|
09/25/2014
| | | | |
Title:
|
FINFET WITH REDUCED CAPACITANCE
|
|
|
Patent #:
|
|
Issue Dt:
|
03/21/2017
|
Application #:
|
13849796
|
Filing Dt:
|
03/25/2013
|
Publication #:
|
|
Pub Dt:
|
09/25/2014
| | | | |
Title:
|
INTERCONNECT LEVEL STRUCTURES FOR CONFINING STITCH-INDUCED VIA STRUCTURES
|
|
|
Patent #:
|
|
Issue Dt:
|
04/14/2015
|
Application #:
|
13851204
|
Filing Dt:
|
03/27/2013
|
Publication #:
|
|
Pub Dt:
|
10/02/2014
| | | | |
Title:
|
THIN CHANNEL MOSFET WITH SILICIDE LOCAL INTERCONNECT
|
|
|
Patent #:
|
|
Issue Dt:
|
10/07/2014
|
Application #:
|
13868564
|
Filing Dt:
|
04/23/2013
|
Publication #:
|
|
Pub Dt:
|
10/23/2014
| | | | |
Title:
|
GRAPHO-EPITAXY DSA PROCESS WITH DIMENSION CONTROL OF TEMPLATE PATTERN
|
|
|
Patent #:
|
|
Issue Dt:
|
11/19/2013
|
Application #:
|
13871026
|
Filing Dt:
|
04/26/2013
|
Publication #:
|
|
Pub Dt:
|
09/12/2013
| | | | |
Title:
|
THREE DIMENSIONAL INTEGRATION AND METHODS OF THROUGH SILICON VIA CREATION
|
|
|
Patent #:
|
|
Issue Dt:
|
01/06/2015
|
Application #:
|
13872371
|
Filing Dt:
|
04/29/2013
|
Publication #:
|
|
Pub Dt:
|
10/30/2014
| | | | |
Title:
|
ANTICIPATORY IMPLANT FOR TSV
|
|
|
Patent #:
|
|
Issue Dt:
|
03/31/2015
|
Application #:
|
13923704
|
Filing Dt:
|
06/21/2013
|
Publication #:
|
|
Pub Dt:
|
10/31/2013
| | | | |
Title:
|
MINIMIZING LEAKAGE CURRENT AND JUNCTION CAPACITANCE IN CMOS TRANSISTORS BY UTILIZING DIELECTRIC SPACERS
|
|
|
Patent #:
|
|
Issue Dt:
|
02/11/2014
|
Application #:
|
13937698
|
Filing Dt:
|
07/09/2013
|
Publication #:
|
|
Pub Dt:
|
11/07/2013
| | | | |
Title:
|
TWO-STEP SILICIDE FORMATION
|
|
|
Patent #:
|
|
Issue Dt:
|
05/12/2015
|
Application #:
|
14036158
|
Filing Dt:
|
09/25/2013
|
Publication #:
|
|
Pub Dt:
|
03/26/2015
| | | | |
Title:
|
SEMICONDUCTOR-ON-INSULATOR (SOI) STRUCTURES WITH LOCAL HEAT DISSIPATER(S) AND METHODS
|
|
|
Patent #:
|
|
Issue Dt:
|
01/10/2017
|
Application #:
|
14036999
|
Filing Dt:
|
09/25/2013
|
Publication #:
|
|
Pub Dt:
|
03/26/2015
| | | | |
Title:
|
PACKAGE ASSEMBLY FOR THIN WAFER SHIPPING AND METHOD OF USE
|
|
|
Patent #:
|
|
Issue Dt:
|
04/28/2015
|
Application #:
|
14041716
|
Filing Dt:
|
09/30/2013
|
Publication #:
|
|
Pub Dt:
|
04/02/2015
| | | | |
Title:
|
HEAT DISSIPATIVE ELECTRICAL ISOLATION/INSULATION STRUCTURE FOR SEMICONDUCTOR DEVICES AND METHOD OF MAKING
|
|
|
Patent #:
|
|
Issue Dt:
|
05/26/2015
|
Application #:
|
14043079
|
Filing Dt:
|
10/01/2013
|
Publication #:
|
|
Pub Dt:
|
01/30/2014
| | | | |
Title:
|
SIDEWALLS OF ELECTROPLATED COPPER INTERCONNECTS
|
|
|
Patent #:
|
|
Issue Dt:
|
06/16/2015
|
Application #:
|
14043104
|
Filing Dt:
|
10/01/2013
|
Publication #:
|
|
Pub Dt:
|
01/30/2014
| | | | |
Title:
|
SIDEWALLS OF ELECTROPLATED COPPER INTERCONNECTS
|
|
|
Patent #:
|
|
Issue Dt:
|
06/09/2015
|
Application #:
|
14043127
|
Filing Dt:
|
10/01/2013
|
Publication #:
|
|
Pub Dt:
|
01/30/2014
| | | | |
Title:
|
SIDEWALLS OF ELECTROPLATED COPPER INTERCONNECTS
|
|
|
Patent #:
|
|
Issue Dt:
|
09/09/2014
|
Application #:
|
14152127
|
Filing Dt:
|
01/10/2014
|
Publication #:
|
|
Pub Dt:
|
05/08/2014
| | | | |
Title:
|
MICROSTRUCTURE MODIFICATION IN COPPER INTERCONNECT STRUCTURES
|
|
|
Patent #:
|
|
Issue Dt:
|
01/30/2018
|
Application #:
|
14154273
|
Filing Dt:
|
01/14/2014
|
Publication #:
|
|
Pub Dt:
|
05/08/2014
| | | | |
Title:
|
STRUCTURES, METHODS AND APPLICATIONS FOR ELECTRICAL PULSE ANNEAL PROCESSES
|
|
|
Patent #:
|
|
Issue Dt:
|
08/12/2014
|
Application #:
|
14181079
|
Filing Dt:
|
02/14/2014
|
Publication #:
|
|
Pub Dt:
|
06/12/2014
| | | | |
Title:
|
INTERCONNECT STRUCTURE WITH AN ELECTROMIGRATION AND STRESS MIGRATION ENHANCEMENT LINER
|
|
|
Patent #:
|
|
Issue Dt:
|
06/20/2017
|
Application #:
|
14183631
|
Filing Dt:
|
02/19/2014
|
Publication #:
|
|
Pub Dt:
|
08/20/2015
| | | | |
Title:
|
APPARATUS AND METHOD FOR CENTERING SUBSTRATES ON A CHUCK
|
|
|
Patent #:
|
|
Issue Dt:
|
08/30/2016
|
Application #:
|
14184003
|
Filing Dt:
|
02/19/2014
|
Publication #:
|
|
Pub Dt:
|
08/20/2015
| | | | |
Title:
|
WIRING STRUCTURE FOR TRENCH FUSE COMPONENT WITH METHODS OF FABRICATION
|
|
|
Patent #:
|
|
Issue Dt:
|
08/30/2016
|
Application #:
|
14199282
|
Filing Dt:
|
03/06/2014
|
Publication #:
|
|
Pub Dt:
|
09/10/2015
| | | | |
Title:
|
DEEP WELL IMPLANT USING BLOCKING MASK
|
|
|
Patent #:
|
|
Issue Dt:
|
12/15/2015
|
Application #:
|
14220288
|
Filing Dt:
|
03/20/2014
|
Publication #:
|
|
Pub Dt:
|
09/24/2015
| | | | |
Title:
|
COMPOSITE DIELECTRIC MATERIALS WITH IMPROVED MECHANICAL AND ELECTRICAL PROPERTIES
|
|
|
Patent #:
|
|
Issue Dt:
|
12/08/2015
|
Application #:
|
14225810
|
Filing Dt:
|
03/26/2014
|
Publication #:
|
|
Pub Dt:
|
10/01/2015
| | | | |
Title:
|
ADVANCED ULTRA LOW K SICOH DIELECTRICS PREPARED BY BUILT-IN ENGINEERED PORE SIZE AND BONDING STRUCTURED WITH CYCLIC ORGANOSILICON PRECURSORS
|
|
|
Patent #:
|
|
Issue Dt:
|
06/21/2016
|
Application #:
|
14259657
|
Filing Dt:
|
04/23/2014
|
Publication #:
|
|
Pub Dt:
|
10/29/2015
| | | | |
Title:
|
DIE LEVEL CHEMICAL MECHANICAL POLISHING
|
|
|
Patent #:
|
|
Issue Dt:
|
03/22/2016
|
Application #:
|
14260724
|
Filing Dt:
|
04/24/2014
|
Publication #:
|
|
Pub Dt:
|
10/29/2015
| | | | |
Title:
|
SELECTIVELY GROWN SELF-ALIGNED FINS FOR DEEP ISOLATION INTEGRATION
|
|
|
Patent #:
|
|
Issue Dt:
|
10/18/2016
|
Application #:
|
14265402
|
Filing Dt:
|
04/30/2014
|
Publication #:
|
|
Pub Dt:
|
11/05/2015
| | | | |
Title:
|
DIRECTIONAL CHEMICAL OXIDE ETCH TECHNIQUE
|
|
|
Patent #:
|
|
Issue Dt:
|
03/20/2018
|
Application #:
|
14269457
|
Filing Dt:
|
05/05/2014
|
Publication #:
|
|
Pub Dt:
|
11/05/2015
| | | | |
Title:
|
GAS-CONTROLLED BONDING PLATFORM FOR EDGE DEFECT REDUCTION DURING WAFER BONDING
|
|
|
Patent #:
|
|
Issue Dt:
|
11/17/2015
|
Application #:
|
14270565
|
Filing Dt:
|
05/06/2014
|
Publication #:
|
|
Pub Dt:
|
11/12/2015
| | | | |
Title:
|
REWORK AND STRIPPING OF COMPLEX PATTERNING LAYERS USING CHEMICAL MECHANICAL POLISHING
|
|
|
Patent #:
|
|
Issue Dt:
|
04/12/2016
|
Application #:
|
14270791
|
Filing Dt:
|
05/06/2014
|
Publication #:
|
|
Pub Dt:
|
11/12/2015
| | | | |
Title:
|
FORMATION OF METAL RESISTOR AND E-FUSE
|
|
|
Patent #:
|
|
Issue Dt:
|
03/01/2016
|
Application #:
|
14277857
|
Filing Dt:
|
05/15/2014
|
Publication #:
|
|
Pub Dt:
|
11/19/2015
| | | | |
Title:
|
GAS CLUSTER REACTOR FOR ANISOTROPIC FILM GROWTH
|
|
|
Patent #:
|
|
Issue Dt:
|
04/12/2016
|
Application #:
|
14281166
|
Filing Dt:
|
05/19/2014
|
Publication #:
|
|
Pub Dt:
|
11/19/2015
| | | | |
Title:
|
SEMICONDUCTOR STRUCTURES HAVING LOW RESISTANCE PATHS THROUGHOUT A WAFER
|
|
|
Patent #:
|
|
Issue Dt:
|
09/13/2016
|
Application #:
|
14282491
|
Filing Dt:
|
05/20/2014
|
Publication #:
|
|
Pub Dt:
|
11/26/2015
| | | | |
Title:
|
PATTERNING PROCESS FOR FIN IMPLANTATION
|
|
|
Patent #:
|
|
Issue Dt:
|
10/11/2016
|
Application #:
|
14289679
|
Filing Dt:
|
05/29/2014
|
Publication #:
|
|
Pub Dt:
|
12/03/2015
| | | | |
Title:
|
VERTICALLY INTEGRATED MEMORY CELL
|
|
|
Patent #:
|
|
Issue Dt:
|
05/10/2016
|
Application #:
|
14302757
|
Filing Dt:
|
06/12/2014
|
Publication #:
|
|
Pub Dt:
|
12/17/2015
| | | | |
Title:
|
MOL RESISTOR WITH METAL GRID HEAT SHIELD
|
|
|
Patent #:
|
|
Issue Dt:
|
03/07/2017
|
Application #:
|
14305502
|
Filing Dt:
|
06/16/2014
|
Publication #:
|
|
Pub Dt:
|
12/17/2015
| | | | |
Title:
|
SHALLOW TRENCH ISOLATION REGIONS MADE FROM CRYSTALLINE OXIDES
|
|
|
Patent #:
|
|
Issue Dt:
|
12/27/2016
|
Application #:
|
14313340
|
Filing Dt:
|
06/24/2014
|
Publication #:
|
|
Pub Dt:
|
12/24/2015
| | | | |
Title:
|
PROTECTIVE TRENCH LAYER AND GATE SPACER IN FINFET DEVICES
|
|
|
Patent #:
|
|
Issue Dt:
|
09/01/2015
|
Application #:
|
14327968
|
Filing Dt:
|
07/10/2014
|
Publication #:
|
|
Pub Dt:
|
10/30/2014
| | | | |
Title:
|
GRAPHO-EPITAXY DSA PROCESS WITH DIMENSION CONTROL OF TEMPLATE PATTERN
|
|
|
Patent #:
|
|
Issue Dt:
|
07/19/2016
|
Application #:
|
14456212
|
Filing Dt:
|
08/11/2014
|
Publication #:
|
|
Pub Dt:
|
11/27/2014
| | | | |
Title:
|
NON-LITHOGRAPHIC LINE PATTERN FORMATION
|
|
|
Patent #:
|
|
Issue Dt:
|
05/03/2016
|
Application #:
|
14457176
|
Filing Dt:
|
08/12/2014
|
Publication #:
|
|
Pub Dt:
|
11/27/2014
| | | | |
Title:
|
NON-LITHOGRAPHIC HOLE PATTERN FORMATION
|
|
|
Patent #:
|
|
Issue Dt:
|
04/19/2016
|
Application #:
|
14459745
|
Filing Dt:
|
08/14/2014
|
Publication #:
|
|
Pub Dt:
|
02/18/2016
| | | | |
Title:
|
WAFER BACKSIDE PARTICLE MITIGATION
|
|
|
Patent #:
|
|
Issue Dt:
|
01/19/2016
|
Application #:
|
14465365
|
Filing Dt:
|
08/21/2014
|
Title:
|
FINFETs CONTAINING IMPROVED STRAIN BENEFIT AND SELF ALIGNED TRENCH ISOLATION STRUCTURES
|
|
|
Patent #:
|
|
Issue Dt:
|
10/25/2016
|
Application #:
|
14488496
|
Filing Dt:
|
09/17/2014
|
Publication #:
|
|
Pub Dt:
|
03/17/2016
| | | | |
Title:
|
Sacrificial Carrier Dicing of Semiconductor Wafers
|
|
|
Patent #:
|
|
Issue Dt:
|
08/02/2016
|
Application #:
|
14501137
|
Filing Dt:
|
09/30/2014
|
Publication #:
|
|
Pub Dt:
|
03/31/2016
| | | | |
Title:
|
DIFFUSION BARRIER LAYER FORMATION
|
|
|
Patent #:
|
|
Issue Dt:
|
08/02/2016
|
Application #:
|
14501445
|
Filing Dt:
|
09/30/2014
|
Publication #:
|
|
Pub Dt:
|
04/16/2015
| | | | |
Title:
|
INTEGRATED DEVICE WITH DEFINED HEAT FLOW
|
|
|
Patent #:
|
|
Issue Dt:
|
11/22/2016
|
Application #:
|
14504964
|
Filing Dt:
|
10/02/2014
|
Publication #:
|
|
Pub Dt:
|
04/07/2016
| | | | |
Title:
|
SEMICONDUCTOR DEVICES WITH SIDEWALL SPACERS OF EQUAL THICKNESS
|
|
|
Patent #:
|
|
Issue Dt:
|
09/13/2016
|
Application #:
|
14532230
|
Filing Dt:
|
11/04/2014
|
Publication #:
|
|
Pub Dt:
|
02/26/2015
| | | | |
Title:
|
SHALLOW TRENCH ISOLATION STRUCTURE HAVING A NITRIDE PLUG
|
|
|
Patent #:
|
|
Issue Dt:
|
12/29/2015
|
Application #:
|
14532281
|
Filing Dt:
|
11/04/2014
|
Publication #:
|
|
Pub Dt:
|
02/26/2015
| | | | |
Title:
|
MULTILAYER MIM CAPACITOR
|
|
|
Patent #:
|
|
Issue Dt:
|
06/27/2017
|
Application #:
|
14551260
|
Filing Dt:
|
11/24/2014
|
Publication #:
|
|
Pub Dt:
|
05/26/2016
| | | | |
Title:
|
DUAL EPITAXY CMOS PROCESSING USING SELECTIVE NITRIDE FORMATION FOR REDUCED GATE PITCH
|
|
|
Patent #:
|
|
Issue Dt:
|
04/19/2016
|
Application #:
|
14556732
|
Filing Dt:
|
12/01/2014
|
Publication #:
|
|
Pub Dt:
|
03/26/2015
| | | | |
Title:
|
CMOS STRUCTURES AND METHODS FOR IMPROVING YIELD
|
|
|
Patent #:
|
|
Issue Dt:
|
08/02/2016
|
Application #:
|
14560203
|
Filing Dt:
|
12/04/2014
|
Publication #:
|
|
Pub Dt:
|
06/09/2016
| | | | |
Title:
|
WET BOTTLING PROCESS FOR SMALL DIAMETER DEEP TRENCH CAPACITORS
|
|
|
Patent #:
|
|
Issue Dt:
|
01/26/2016
|
Application #:
|
14568531
|
Filing Dt:
|
12/12/2014
|
Title:
|
STRUCTURE FOR METAL OXIDE SEMICONDUCTOR CAPACITOR
|
|
|
Patent #:
|
|
Issue Dt:
|
05/23/2017
|
Application #:
|
14568969
|
Filing Dt:
|
12/12/2014
|
Publication #:
|
|
Pub Dt:
|
06/16/2016
| | | | |
Title:
|
FIN REPLACEMENT IN A FIELD-EFFECT TRANSISTOR
|
|
|
Patent #:
|
|
Issue Dt:
|
09/13/2016
|
Application #:
|
14571352
|
Filing Dt:
|
12/16/2014
|
Publication #:
|
|
Pub Dt:
|
06/16/2016
| | | | |
Title:
|
INTERPOSER WITH LATTICE CONSTRUCTION AND EMBEDDED CONDUCTIVE METAL STRUCTURES
|
|