Patent Assignment Details
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| Reel/Frame: | 012094/0162 | |
| Pages: | 8 |
| | Recorded: | 08/17/2001 | | |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE THIRD ASSIGNOR'S NAME PREVIOUSLY RECORDED ON REEL 011378, FRAME 0177. ASSIGNOR HEREBY CONFIRMS THE ASSIGNMENT OF THE ENTIRE INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/22/2002
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Application #:
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09730721
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Filing Dt:
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12/06/2000
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Title:
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Making semiconductor packages with stacked dies and reinforced wire bonds
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Assignee
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| 1900 S. PRICE ROAD |
| CHANDLER, ARIZONA 85248 |
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Correspondence name and address
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SKJERVEN MORRILL MACPHERSON LLP
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DON C. LAWRENCE
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25 METRO DRIVE, SUITE 700
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SAN JOSE, CA 95110
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