Patent Assignment Details
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| Reel/Frame: | 025217/0167 | |
| Pages: | 2 |
| | Recorded: | 10/29/2010 | | |
| Attorney Dkt #: | 2000300 |
| Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/21/1997
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Application #:
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08348288
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Filing Dt:
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11/30/1994
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Title:
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HIGH POWER DISSIPATION PLASTIC ENCAPSULATED PACKAGE FOR INTEGRATED CIRCUIT DIE
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Assignee
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| 28 FUI YIU KOK STREET |
| UNIT E, 9/F METEX HOUSE |
| TSUEN WAN, N.T., HONG KONG |
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Correspondence name and address
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MITCHELL M. WONG
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40 WALL STREET, FLOOR 28
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THE EXETER LAW GROUP LLP
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NEW YORK, NY 10005
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