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Patent Assignment Details
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Reel/Frame:027499/0167   Pages: 2
Recorded: 01/09/2012
Attorney Dkt #:OP-100001137
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
13345849
Filing Dt:
01/09/2012
Publication #:
Pub Dt:
07/11/2013
Title:
HEAT-CONDUCTING MODULE AND METHOD FOR MANUFACTURING THE SAME
Assignors
1
Exec Dt:
11/30/2011
2
Exec Dt:
11/30/2011
Assignee
1
9F., NO.778-1, ZHONGZHENG RD., ZHONGHE DIST.
NEW TAIPEI CITY, TAIWAN 235
Correspondence name and address
HDLS IPR SERVICES
PO BOX 220746
CHANTILLY, VA 20153

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