Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 017404/0168 | |
| Pages: | 3 |
| | Recorded: | 12/22/2005 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
02/17/2009
|
Application #:
|
11314341
|
Filing Dt:
|
12/22/2005
|
|
Publication #:
|
|
Pub Dt:
|
03/01/2007
| | | | |
|
Title:
|
WAFER LEVEL PACKAGE AND METHOD FOR MAKING THE SAME
|
|
|
Assignee
|
|
|
|
|
| 26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE |
| KAOSHIUNG, TAIWAN R.O.C. |
|
|
Correspondence name and address
|
| |
ANDREW J. TELESZ, JR., REG. NO. 33,581
|
| |
VOLENTINE FRANCOS & WHITT, P.L.L.C.
|
| |
11951 FREEDOM DRIVE, SUITE 1260
|
| |
RESTON, VA 20190
|
Search Results as of:
05/23/2024 03:29 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
