Total properties:
56
|
|
Patent #:
|
|
Issue Dt:
|
04/08/2003
|
Application #:
|
09996748
|
Filing Dt:
|
11/30/2001
|
Publication #:
|
|
Pub Dt:
|
06/06/2002
| | | | |
Title:
|
EMBEDDED ATTENUATED PHASE SHIFT MASK AND METHOD OF MAKING EMBEDDED ATTENUATED PHASE SHIFT MASK
|
|
|
Patent #:
|
|
Issue Dt:
|
08/03/2004
|
Application #:
|
10163567
|
Filing Dt:
|
06/06/2002
|
Publication #:
|
|
Pub Dt:
|
01/30/2003
| | | | |
Title:
|
PERIMETER SEAL FOR BACKSIDE COOLING OF SUBSTRATES
|
|
|
Patent #:
|
|
Issue Dt:
|
01/25/2005
|
Application #:
|
10407831
|
Filing Dt:
|
04/04/2003
|
Publication #:
|
|
Pub Dt:
|
11/20/2003
| | | | |
Title:
|
METHOD FOR ETCHING VIAS
|
|
|
Patent #:
|
|
Issue Dt:
|
06/14/2005
|
Application #:
|
10601076
|
Filing Dt:
|
06/19/2003
|
Publication #:
|
|
Pub Dt:
|
03/25/2004
| | | | |
Title:
|
NOTCH-FREE ETCHING OF HIGH ASPECT SOI STRUCTURES USING ALTERNATING DEPOSITION AND ETCHING AND PULSED PLASMA
|
|
|
Patent #:
|
|
Issue Dt:
|
08/02/2005
|
Application #:
|
10640469
|
Filing Dt:
|
08/12/2003
|
Publication #:
|
|
Pub Dt:
|
05/13/2004
| | | | |
Title:
|
SIDEWALL SMOOTHING IN HIGH ASPECT RATIO/DEEP ETCHING USING A DISCRETE GAS SWITCHING METHOD
|
|
|
Patent #:
|
|
Issue Dt:
|
01/03/2006
|
Application #:
|
10770839
|
Filing Dt:
|
02/02/2004
|
Publication #:
|
|
Pub Dt:
|
09/09/2004
| | | | |
Title:
|
END POINT DETECTION IN TIME DIVISION MULTIPLEXED ETCH PROCESSES
|
|
|
Patent #:
|
|
Issue Dt:
|
10/03/2006
|
Application #:
|
10815965
|
Filing Dt:
|
03/31/2004
|
Publication #:
|
|
Pub Dt:
|
11/25/2004
| | | | |
Title:
|
METHOD AND APPARATUS FOR PROCESS CONTROL IN TIME DIVISION MULTIPLEXED (TDM) ETCH PROCESS
|
|
|
Patent #:
|
|
Issue Dt:
|
03/07/2006
|
Application #:
|
10839809
|
Filing Dt:
|
05/03/2004
|
Publication #:
|
|
Pub Dt:
|
12/23/2004
| | | | |
Title:
|
ETCHING OF CHROMIUM LAYERS ON PHOTOMASKS UTILIZING HIGH DENSITY PLASMA AND LOW FREQUENCY RF BIAS
|
|
|
Patent #:
|
|
Issue Dt:
|
09/05/2006
|
Application #:
|
10841818
|
Filing Dt:
|
05/06/2004
|
Publication #:
|
|
Pub Dt:
|
12/02/2004
| | | | |
Title:
|
ENVELOPE FOLLOWER END POINT DETECTION IN TIME DIVISION MULTIPLEXED PROCESSES
|
|
|
Patent #:
|
|
Issue Dt:
|
06/03/2008
|
Application #:
|
11155904
|
Filing Dt:
|
06/20/2005
|
Publication #:
|
|
Pub Dt:
|
12/01/2005
| | | | |
Title:
|
METHOD AND APPARATUS FOR PROCESS CONTROL IN TIME DIVISION MULTIPLEXED (TDM) ETCH PROCESSES
|
|
|
Patent #:
|
|
Issue Dt:
|
06/14/2011
|
Application #:
|
11159415
|
Filing Dt:
|
06/23/2005
|
Publication #:
|
|
Pub Dt:
|
12/29/2005
| | | | |
Title:
|
METHOD AND APPARATUS FOR REDUCING ASPECT RATIO DEPENDENT ETCHING IN TIME DIVISION MULTIPLEXED ETCH PROCESSES
|
|
|
Patent #:
|
|
Issue Dt:
|
05/11/2010
|
Application #:
|
11229319
|
Filing Dt:
|
09/16/2005
|
Publication #:
|
|
Pub Dt:
|
04/06/2006
| | | | |
Title:
|
METHOD & APPARATUS TO IMPROVE PLASMA ETCH UNIFORMITY
|
|
|
Patent #:
|
|
Issue Dt:
|
12/01/2009
|
Application #:
|
11441811
|
Filing Dt:
|
05/26/2006
|
Publication #:
|
|
Pub Dt:
|
12/21/2006
| | | | |
Title:
|
PROCESS CHANGE DETECTION THROUGH THE USE OF EVOLUTIONARY ALGORITHMS
|
|
|
Patent #:
|
|
Issue Dt:
|
11/16/2010
|
Application #:
|
11502585
|
Filing Dt:
|
08/10/2006
|
Publication #:
|
|
Pub Dt:
|
02/22/2007
| | | | |
Title:
|
OPTICAL EMISSION INTERFEROMETRY FOR PECVD USING A GAS INJECTION HOLE
|
|
|
Patent #:
|
|
Issue Dt:
|
07/06/2010
|
Application #:
|
11634377
|
Filing Dt:
|
12/04/2006
|
Publication #:
|
|
Pub Dt:
|
06/21/2007
| | | | |
Title:
|
METHOD FOR ETCHING PHOTOLITHOGRAPHIC SUBSTRATES
|
|
|
Patent #:
|
|
Issue Dt:
|
01/11/2011
|
Application #:
|
11756074
|
Filing Dt:
|
05/31/2007
|
Publication #:
|
|
Pub Dt:
|
06/26/2008
| | | | |
Title:
|
TEMPERATURE CONTROL METHOD FOR PHOTOLITHOGRAPHIC SUBSTRATE
|
|
|
Patent #:
|
|
Issue Dt:
|
11/09/2010
|
Application #:
|
11834127
|
Filing Dt:
|
08/06/2007
|
Publication #:
|
|
Pub Dt:
|
03/13/2008
| | | | |
Title:
|
METHOD FOR PLASMA ETCHING OF POSITIVELY SLOPED STRUCTURES
|
|
|
Patent #:
|
|
Issue Dt:
|
05/29/2012
|
Application #:
|
11834299
|
Filing Dt:
|
08/06/2007
|
Publication #:
|
|
Pub Dt:
|
02/14/2008
| | | | |
Title:
|
METHOD TO MINIMIZE CD ETCH BIAS
|
|
|
Patent #:
|
|
Issue Dt:
|
04/22/2014
|
Application #:
|
12244681
|
Filing Dt:
|
10/02/2008
|
Title:
|
GRID ASSEMBLIES FOR USE IN ION BEAM ETCHING SYSTEMS AND METHODS OF UTILIZING THE GRID ASSEMBLIES
|
|
|
Patent #:
|
|
Issue Dt:
|
03/20/2012
|
Application #:
|
12689784
|
Filing Dt:
|
01/19/2010
|
Publication #:
|
|
Pub Dt:
|
02/03/2011
| | | | |
Title:
|
CONDUCTIVE SEAL RING ELECTROSTATIC CHUCK
|
|
|
Patent #:
|
|
Issue Dt:
|
03/03/2015
|
Application #:
|
12990143
|
Filing Dt:
|
01/24/2011
|
Publication #:
|
|
Pub Dt:
|
06/16/2011
| | | | |
Title:
|
DEVICE AND PROCESS FOR CHEMICAL VAPOR PHASE TREATMENT
|
|
|
Patent #:
|
|
Issue Dt:
|
08/12/2014
|
Application #:
|
13412119
|
Filing Dt:
|
03/05/2012
|
Publication #:
|
|
Pub Dt:
|
03/14/2013
| | | | |
Title:
|
METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER
|
|
|
Patent #:
|
|
Issue Dt:
|
07/15/2014
|
Application #:
|
13448769
|
Filing Dt:
|
04/17/2012
|
Publication #:
|
|
Pub Dt:
|
09/20/2012
| | | | |
Title:
|
METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER
|
|
|
Patent #:
|
|
Issue Dt:
|
08/05/2014
|
Application #:
|
13764110
|
Filing Dt:
|
02/11/2013
|
Publication #:
|
|
Pub Dt:
|
09/05/2013
| | | | |
Title:
|
METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER
|
|
|
Patent #:
|
|
Issue Dt:
|
07/22/2014
|
Application #:
|
13764142
|
Filing Dt:
|
02/11/2013
|
Publication #:
|
|
Pub Dt:
|
09/05/2013
| | | | |
Title:
|
METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER
|
|
|
Patent #:
|
|
Issue Dt:
|
03/17/2015
|
Application #:
|
13764160
|
Filing Dt:
|
02/11/2013
|
Publication #:
|
|
Pub Dt:
|
09/05/2013
| | | | |
Title:
|
METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER
|
|
|
Patent #:
|
|
Issue Dt:
|
12/01/2015
|
Application #:
|
13764177
|
Filing Dt:
|
02/11/2013
|
Publication #:
|
|
Pub Dt:
|
09/05/2013
| | | | |
Title:
|
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
|
|
|
Patent #:
|
|
Issue Dt:
|
02/03/2015
|
Application #:
|
13767459
|
Filing Dt:
|
02/14/2013
|
Publication #:
|
|
Pub Dt:
|
09/05/2013
| | | | |
Title:
|
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
|
|
|
Patent #:
|
|
Issue Dt:
|
06/30/2015
|
Application #:
|
13787032
|
Filing Dt:
|
03/06/2013
|
Publication #:
|
|
Pub Dt:
|
09/05/2013
| | | | |
Title:
|
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
|
|
|
Patent #:
|
|
Issue Dt:
|
08/11/2015
|
Application #:
|
13787153
|
Filing Dt:
|
03/06/2013
|
Publication #:
|
|
Pub Dt:
|
08/21/2014
| | | | |
Title:
|
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
|
|
|
Patent #:
|
|
Issue Dt:
|
04/08/2014
|
Application #:
|
13829324
|
Filing Dt:
|
03/14/2013
|
Publication #:
|
|
Pub Dt:
|
09/05/2013
| | | | |
Title:
|
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
|
|
|
Patent #:
|
|
Issue Dt:
|
05/17/2016
|
Application #:
|
14014040
|
Filing Dt:
|
08/29/2013
|
Publication #:
|
|
Pub Dt:
|
12/26/2013
| | | | |
Title:
|
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
|
|
|
Patent #:
|
|
Issue Dt:
|
06/14/2016
|
Application #:
|
14034164
|
Filing Dt:
|
09/23/2013
|
Publication #:
|
|
Pub Dt:
|
04/03/2014
| | | | |
Title:
|
Method for Dicing a Substrate with Back Metal
|
|
|
Patent #:
|
|
Issue Dt:
|
12/01/2015
|
Application #:
|
14176747
|
Filing Dt:
|
02/10/2014
|
Publication #:
|
|
Pub Dt:
|
06/05/2014
| | | | |
Title:
|
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
|
|
|
Patent #:
|
|
Issue Dt:
|
07/14/2015
|
Application #:
|
14201409
|
Filing Dt:
|
03/07/2014
|
Publication #:
|
|
Pub Dt:
|
08/28/2014
| | | | |
Title:
|
METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER
|
|
|
Patent #:
|
|
Issue Dt:
|
01/09/2018
|
Application #:
|
14697441
|
Filing Dt:
|
04/27/2015
|
Publication #:
|
|
Pub Dt:
|
10/29/2015
| | | | |
Title:
|
WAFER STAGE FOR SYMMETRIC WAFER PROCESSING
|
|
|
Patent #:
|
|
Issue Dt:
|
11/15/2016
|
Application #:
|
14721443
|
Filing Dt:
|
05/26/2015
|
Publication #:
|
|
Pub Dt:
|
09/10/2015
| | | | |
Title:
|
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
|
|
|
Patent #:
|
|
Issue Dt:
|
12/01/2015
|
Application #:
|
14728517
|
Filing Dt:
|
06/02/2015
|
Publication #:
|
|
Pub Dt:
|
09/24/2015
| | | | |
Title:
|
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
|
|
|
Patent #:
|
|
Issue Dt:
|
02/25/2020
|
Application #:
|
14729610
|
Filing Dt:
|
06/03/2015
|
Publication #:
|
|
Pub Dt:
|
09/24/2015
| | | | |
Title:
|
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
|
|
|
Patent #:
|
|
Issue Dt:
|
10/03/2017
|
Application #:
|
14769414
|
Filing Dt:
|
08/20/2015
|
Publication #:
|
|
Pub Dt:
|
01/07/2016
| | | | |
Title:
|
CHEMICAL VAPOR DEPOSITION DEVICE
|
|
|
Patent #:
|
|
Issue Dt:
|
05/21/2019
|
Application #:
|
14842365
|
Filing Dt:
|
09/01/2015
|
Publication #:
|
|
Pub Dt:
|
12/24/2015
| | | | |
Title:
|
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
|
|
|
Patent #:
|
|
Issue Dt:
|
03/14/2017
|
Application #:
|
14854127
|
Filing Dt:
|
09/15/2015
|
Title:
|
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
|
|
|
Patent #:
|
|
Issue Dt:
|
02/07/2017
|
Application #:
|
14974840
|
Filing Dt:
|
12/18/2015
|
Publication #:
|
|
Pub Dt:
|
04/21/2016
| | | | |
Title:
|
METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER
|
|
|
Patent #:
|
|
Issue Dt:
|
12/03/2019
|
Application #:
|
15148707
|
Filing Dt:
|
05/06/2016
|
Publication #:
|
|
Pub Dt:
|
09/06/2018
| | | | |
Title:
|
Method for Dicing a Substrate with Back Metal
|
|
|
Patent #:
|
|
Issue Dt:
|
01/09/2018
|
Application #:
|
15206300
|
Filing Dt:
|
07/10/2016
|
Title:
|
POWERED ANODE FOR ION SOURCE FOR DLC AND REACTIVE PROCESSES
|
|
|
Patent #:
|
|
Issue Dt:
|
03/06/2018
|
Application #:
|
15287412
|
Filing Dt:
|
10/06/2016
|
Publication #:
|
|
Pub Dt:
|
01/26/2017
| | | | |
Title:
|
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
|
|
|
Patent #:
|
|
Issue Dt:
|
07/18/2017
|
Application #:
|
15287501
|
Filing Dt:
|
10/06/2016
|
Publication #:
|
|
Pub Dt:
|
02/02/2017
| | | | |
Title:
|
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
|
|
|
Patent #:
|
|
Issue Dt:
|
04/02/2019
|
Application #:
|
15328413
|
Filing Dt:
|
01/23/2017
|
Publication #:
|
|
Pub Dt:
|
07/20/2017
| | | | |
Title:
|
METHOD FOR REMOVING A METAL DEPOSIT PLACED ON A SURFACE IN A CHAMBER
|
|
|
Patent #:
|
|
Issue Dt:
|
04/23/2019
|
Application #:
|
15824166
|
Filing Dt:
|
11/28/2017
|
Publication #:
|
|
Pub Dt:
|
05/31/2018
| | | | |
Title:
|
METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER
|
|
|
Patent #:
|
|
Issue Dt:
|
07/27/2021
|
Application #:
|
15870890
|
Filing Dt:
|
01/13/2018
|
Publication #:
|
|
Pub Dt:
|
06/07/2018
| | | | |
Title:
|
Device for Treating an Object with Plasma
|
|
|
Patent #:
|
|
Issue Dt:
|
08/11/2020
|
Application #:
|
15910561
|
Filing Dt:
|
03/02/2018
|
Publication #:
|
|
Pub Dt:
|
07/05/2018
| | | | |
Title:
|
Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
|
|
|
Patent #:
|
|
Issue Dt:
|
09/08/2020
|
Application #:
|
16070491
|
Filing Dt:
|
07/16/2018
|
Publication #:
|
|
Pub Dt:
|
01/31/2019
| | | | |
Title:
|
METHOD FOR REMOVING A METAL DEPOSIT ARRANGED ON A SURFACE IN A CHAMBER
|
|
|
Patent #:
|
|
Issue Dt:
|
09/07/2021
|
Application #:
|
16070506
|
Filing Dt:
|
07/16/2018
|
Publication #:
|
|
Pub Dt:
|
07/01/2021
| | | | |
Title:
|
METHOD FOR PRODUCING AN INTERCONNECTION COMPRISING A VIA EXTENDING THROUGH A SUBSTRATE
|
|
|
Patent #:
|
|
Issue Dt:
|
07/07/2020
|
Application #:
|
16132040
|
Filing Dt:
|
09/14/2018
|
Publication #:
|
|
Pub Dt:
|
01/10/2019
| | | | |
Title:
|
METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER
|
|
|
Patent #:
|
|
Issue Dt:
|
10/27/2020
|
Application #:
|
16279560
|
Filing Dt:
|
02/19/2019
|
Publication #:
|
|
Pub Dt:
|
06/20/2019
| | | | |
Title:
|
METHOD AND APPARATUS FOR PLASMA DICING A SEMI-CONDUCTOR WAFER
|
|
|
Patent #:
|
|
Issue Dt:
|
03/09/2021
|
Application #:
|
16358017
|
Filing Dt:
|
03/19/2019
|
Publication #:
|
|
Pub Dt:
|
03/12/2020
| | | | |
Title:
|
Method for Dicing Die Attach Film
|
|