Patent Assignment Details
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Reel/Frame: | 026723/0170 | |
| Pages: | 3 |
| | Recorded: | 08/09/2011 | | |
Attorney Dkt #: | ASE2428 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13206346
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Filing Dt:
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08/09/2011
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Publication #:
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Pub Dt:
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02/14/2013
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Title:
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STACKABLE WAFER LEVEL PACKAGES AND RELATED METHODS
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Assignee
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NO. 26, CHIN 3RD ROAD |
NANTZE EXPORT PROCESSING ZONE |
KAOHSIUNG, TAIWAN |
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Correspondence name and address
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KLEIN, O'NEILL & SINGH, LLP
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18200 VON KARMAN AVENUE
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SUITE 725
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IRVINE, CA 92612
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