Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 018696/0172 | |
| Pages: | 2 |
| | Recorded: | 12/30/2006 | | |
Attorney Dkt #: | 12056-0021 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10568591
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Filing Dt:
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11/03/2006
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Publication #:
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Pub Dt:
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08/16/2007
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Title:
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Heater chip for thermocompression bonding
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Assignee
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182-1, OTSUBO-CHO |
SETO-SHI, AICHI, JAPAN 4890962 |
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Correspondence name and address
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CLARK AND BRODY
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1090 VERMONT AVENUE, NW
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SUITE 250
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WASHINGTON, DC 20005
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