Patent Assignment Details
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Reel/Frame: | 061740/0172 | |
| Pages: | 3 |
| | Recorded: | 11/11/2022 | | |
Attorney Dkt #: | 1012-3327 / 2022P01293 US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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17977640
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Filing Dt:
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10/31/2022
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Publication #:
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Pub Dt:
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05/02/2024
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Title:
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Semiconductor Package with Molded Heat Dissipation Plate
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Assignee
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SIEMENSSTRASSE 2 |
VILLACH, AUSTRIA 9500 |
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Correspondence name and address
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MURPHY, BILAK & HOMILLER/INFINEON TECHNO
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PO BOX 1959
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CARY, NC 27512-1959
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05/31/2024 07:11 PM
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