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Reel/Frame:043125/0176   Pages: 4
Recorded: 07/28/2017
Attorney Dkt #:252011-6480
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
07/03/2018
Application #:
15492525
Filing Dt:
04/20/2017
Title:
METHOD FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE WITH BUMPS
Assignors
1
Exec Dt:
07/19/2017
2
Exec Dt:
06/05/2017
3
Exec Dt:
06/06/2017
4
Exec Dt:
06/05/2017
5
Exec Dt:
07/04/2017
6
Exec Dt:
07/05/2017
Assignee
1
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondence name and address
MCCLURE, QUALEY & RODACK, LLP
3100 INTERSTATE NORTH CIRCLE
SUITE 150
ATLANTA, GA 30339

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