Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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Reel/Frame: | 019601/0177 | |
| Pages: | 6 |
| | Recorded: | 07/23/2007 | | |
Attorney Dkt #: | 108298887US |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/20/2010
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Application #:
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11742297
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Filing Dt:
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04/30/2007
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Publication #:
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Pub Dt:
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09/18/2008
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Title:
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APPARATUS FOR PACKAGING SEMICONDUCTOR DEVICES, PACKAGED SEMICONDUCTOR COMPONENTS, METHODS OF MANUFACTURING APPARATUS FOR PACKAGING SEMICONDUCTOR DEVICES, AND METHODS OF MANUFACTURING SEMICONDUCTOR COMPONENTS
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Assignee
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8000 SOUTH FEDERAL WAY |
P.O. BOX 6 |
BOISE, IDAHO 83716-9632 |
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Correspondence name and address
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PERKINS COIE LLP
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P.O. BOX 1247
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PAUL T. PARKER
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SEATTLE, WA 98111-1247
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