Patent Assignment Details
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| Reel/Frame: | 026711/0177 | |
| Pages: | 3 |
| | Recorded: | 08/05/2011 | | |
| Attorney Dkt #: | 085027-0727 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/30/2013
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Application #:
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13158315
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Filing Dt:
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06/10/2011
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Publication #:
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Pub Dt:
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12/15/2011
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Title:
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WAFER LEVEL PROCESSING METHOD AND STRUCTURE TO MANUFACTURE SEMICONDUCTOR CHIP
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Assignee
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| 8F.-1, NO. 29, PUDING ROAD, EAST DISTRICT |
| HSIN-CHU, TAIWAN 30072 |
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Correspondence name and address
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MCDERMOTT WILL & EMERY, LLP
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600 13TH STREET, NW
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ATTN: DENNIS A. DUCHENE
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WASHINGTON, DC 20005-3096
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