Patent Assignment Details
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| Reel/Frame: | 016257/0178 | |
| Pages: | 3 |
| | Recorded: | 02/05/2005 | | |
| Attorney Dkt #: | CU-4075 RJS |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11051757
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Filing Dt:
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02/04/2005
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Publication #:
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Pub Dt:
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07/27/2006
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Title:
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Slurry for polishing copper film and method for polishing copper film using the same
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Assignee
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| 1, HYANGJEONG-DONG |
| HUNGDUK-GU, CHEONGJU-SI |
| CHUNGCHEONGBUK-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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RICHARD J. STREIT
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C/O LADAS & PARRY LLP
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224 SOUTH MICHIGAN AVENUE
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CHICAGO, IL 60604
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