Patent Assignment Details
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| Reel/Frame: | 014787/0179 | |
| Pages: | 2 |
| | Recorded: | 12/10/2003 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/02/2006
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Application #:
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10731480
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Filing Dt:
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12/10/2003
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Publication #:
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Pub Dt:
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01/20/2005
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Title:
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METHOD OF FORMING METAL LINE IN SEMICONDUCTOR DEVICE
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Assignee
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| SAN 136-1, AMI-RI, BUBAL-UEP |
| ICHON-SHI, KYUNGKI-DO, KOREA, REPUBLIC OF |
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Correspondence name and address
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JACOBSON HOLMAN PLLC
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400 SEVENTH STREET N.W.
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SUITE 600
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WASHINGTON, DC 20004
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