Patent Assignment Details
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| Reel/Frame: | 031078/0180 | |
| Pages: | 10 |
| | Recorded: | 08/01/2013 | | |
| Conveyance: | CORRECTIVE ASSIGNMENT TO CORRECT THE MISSING NON-PROV APP SERIAL NUMBER IN SECTION 10 OF DOCUMENT PREVIOUSLY RECORDED ON REEL 030023 FRAME 0017. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/16/2015
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Application #:
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13842582
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Filing Dt:
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03/15/2013
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Publication #:
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Pub Dt:
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12/05/2013
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Title:
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INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SUBSTRATE AND METHOD OF MANUFACTURE THEREOF
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Assignee
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| 10 ANG MO KIO STREET 65 |
| #05-17/20 TECHPOINT |
| SINGAPORE, SINGAPORE 569059 |
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Correspondence name and address
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ISHIMARU & ASSOCIATES LLP
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2055 GATEWAY PLACE
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SUITE 700
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SAN JOSE, CALIFORNIA 95110
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