Patent Assignment Details
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Reel/Frame: | 018774/0182 | |
| Pages: | 2 |
| | Recorded: | 01/08/2007 | | |
Attorney Dkt #: | EI-2-06-011 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11650520
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Filing Dt:
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01/08/2007
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Publication #:
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Pub Dt:
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07/10/2008
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Title:
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Method of making circuitized substrate with solder balls having roughened surfaces, method of making electrical assembly including said circuitized substrate, and method of making multiple circuitized substrate assembly
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Assignee
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1701 NORTH STREET |
ENDICOTT, NEW YORK 13760 |
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Correspondence name and address
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HINMAN, HOWARD & KATTELL, LLP
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700 SECURITY MUTUAL BUILDING
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80 EXCHANGE STREET
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BINGHAMTON, NY 13901
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