Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 060427/0184 | |
| Pages: | 5 |
| | Recorded: | 07/07/2022 | | |
| Attorney Dkt #: | 21-1333-US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/21/2023
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Application #:
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17810989
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Filing Dt:
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07/06/2022
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Publication #:
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Pub Dt:
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01/19/2023
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Title:
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THERMOPLASTIC RESIN COMPOSITION HAVING HIGH RIGIDITY AND LOW COEFFICIENT OF LINEAR THERMAL EXPANSION AND MOLDED ARTICLE COMPRISING SAME
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Assignees
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| 12, HEOLLEUNG-RO |
| SEOCHO-GU |
| SEOUL, KOREA, REPUBLIC OF 06797 |
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| 12, HEOLLEUNG-RO |
| SEOCHO-GU |
| SEOUL, KOREA, REPUBLIC OF 06797 |
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| 773 SUNSEONG-RO, SUNSEONGMYEON |
| CHUNGCHEONGNAM-DO |
| DANGJIN-SI, KOREA, REPUBLIC OF 91758 |
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Correspondence name and address
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JORDAN J. PRINGLE
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300 SOUTH WACKER DRIVE
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CHICAGO, IL 60606
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