Patent Assignment Details
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| Reel/Frame: | 051701/0185 | |
| Pages: | 4 |
| | Recorded: | 02/03/2020 | | |
| Attorney Dkt #: | 21XD-309185-US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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02/14/2023
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Application #:
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16778736
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Filing Dt:
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01/31/2020
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Publication #:
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Pub Dt:
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07/23/2020
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Title:
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LEAD-FREE SOLDER PASTE AS THERMAL INTERFACE MATERIAL
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Assignee
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| 111 BUSINESS PARK DRIVE |
| UTICA, NEW YORK 13502 |
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Correspondence name and address
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SHEPPARD, MULLIN, RICHTER & HAMPTON LLP
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650 TOWN CENTER DRIVE, 4TH FLOOR
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COSTA MESA, CA 92626
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05/29/2024 03:56 AM
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