Patent Assignment Details
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Reel/Frame: | 036442/0188 | |
| Pages: | 8 |
| | Recorded: | 08/27/2015 | | |
Attorney Dkt #: | NGC-00170(004093-804) |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/23/2016
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Application #:
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14837718
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Filing Dt:
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08/27/2015
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Title:
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YIELD ENHANCING VERTICAL REDUNDANCY METHOD FOR 3D WAFER LEVEL PACKAGED (WLP) INTEGRATED CIRCUIT SYSTEMS
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Assignee
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2980 FAIRVIEW PARK DRIVE |
FALLS CHURCH, VIRGINIA 22042-4511 |
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Correspondence name and address
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JOHN A MILLER, MILLER IP GROUP, PLC
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42690 WOODWARD AVE., STE. 300
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BLOOMFIELD HILLS, MI 48304
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