Patent Assignment Details
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| Reel/Frame: | 005956/0190 | |
| Pages: | 3 |
| | Recorded: | 12/16/1991 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/10/1994
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Application #:
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07807584
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Filing Dt:
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12/16/1991
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Title:
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METHOD AND APPARATUS FOR CLEAVING A SEMICONDUCTOR WAFER INTO INDIVIDUAL DIE AND PROVIDING FOR LOW STRESS DIE REMOVAL
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Correspondence name and address
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RICHARD V. LANG
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GENERAL ELECTRIC COMPANY
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ELECTRONICS PARK 6-102
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P. O. BOX 4840
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SYRACUSE, NY 13221-4840
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