Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 023778/0191 | |
| Pages: | 4 |
| | Recorded: | 01/14/2010 | | |
| Attorney Dkt #: | TESSERA 5.2-024 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
5
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/10/2000
|
Application #:
|
08469990
|
Filing Dt:
|
06/06/1995
|
|
Title:
|
Semiconductor Chip Package Having Chip-To-Carrier
Mechanical/Electrical Connection Formed Via Solid State Diffusion
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/18/2001
|
Application #:
|
08815656
|
Filing Dt:
|
03/13/1997
|
|
Title:
|
PROCESS TO PRODUCE A HIGH TEMPERATURE INTERCONNECTION
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
01/08/2002
|
Application #:
|
09116368
|
Filing Dt:
|
07/16/1998
|
|
Publication #:
|
|
Pub Dt:
|
09/06/2001
| | | | |
|
Title:
|
A FIXTURE FOR ATTACHING A CONFORMAL CHIP CARRIER TO A FLIP CHIP
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
10/17/2000
|
Application #:
|
09169249
|
Filing Dt:
|
10/09/1998
|
|
Title:
|
METHOD FOR BUILDING INTERCONNECT STRUCTURES BY INJECTION MOLDED SOLDER AND STRUCTURES BUILT
|
|
|
|
|
Patent #:
|
|
Issue Dt:
|
12/25/2001
|
Application #:
|
09578319
|
Filing Dt:
|
05/24/2000
|
|
Title:
|
Etched glass solder bump transfer for flip chip integrated circuit devices
|
|
|
Assignee
|
|
|
|
|
| 3025 ORCHARD PARKWAY |
| SAN JOSE, CALIFORNIA 95134 |
|
|
Correspondence name and address
|
| |
DARYL K. NEFF
|
| |
LERNER, DAVID, LITTENBERG, KRUMHOLZ &
|
| |
MENTLIK, LLP
|
| |
600 SOUTH AVENUE WEST
|
| |
WESTFIELD, NJ 07090
|
Search Results as of:
05/28/2024 05:29 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
