Patent Assignment Details
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| Reel/Frame: | 022103/0192 | |
| Pages: | 4 |
| | Recorded: | 01/14/2009 | | |
| Attorney Dkt #: | TW-GNA-0781 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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12353275
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Filing Dt:
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01/14/2009
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Publication #:
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Pub Dt:
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12/17/2009
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Title:
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Die Rearrangement Package Structure and the Forming Method Thereof
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Assignees
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| NO.1. R&D RD.1, SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU CITY, TAIWAN |
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| CANON'S COURT, 22 VICTORIA STREET |
| HAMILTON HM 12, BERMUDA |
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Correspondence name and address
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SINORICA, LLC
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528 FALLSGROVE DRIVE
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ROCKVILLE, MD 20850
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