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Reel/Frame:050779/0192   Pages: 4
Recorded: 10/21/2019
Attorney Dkt #:2012-0691/24061.2880US06
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
Issue Dt:
02/23/2021
Application #:
16658862
Filing Dt:
10/21/2019
Publication #:
Pub Dt:
02/13/2020
Title:
Method of Semiconductor Integrated Circuit Fabrication
Assignors
1
Exec Dt:
06/30/2014
2
Exec Dt:
08/15/2014
3
Exec Dt:
07/02/2014
4
Exec Dt:
06/30/2014
Assignee
1
NO. 8, LI-HSIN RD. 6
SCIENCE-BASED INDUSTRIAL PARK
HSIN-CHU, TAIWAN 300-77
Correspondence name and address
HAYNES AND BOONE, LLP IP SECTION
2323 VICTORY AVENUE
SUITE 700
DALLAS, TX 75219

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