Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 051907/0193 | |
| Pages: | 5 |
| | Recorded: | 02/24/2020 | | |
| Attorney Dkt #: | 5706-000019-US-NP |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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08/17/2021
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Application #:
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16641538
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Filing Dt:
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02/24/2020
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Publication #:
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Pub Dt:
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07/16/2020
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Title:
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INDIUM PHOSPHIDE WAFER HAVING PITS ON THE BACK SIDE, METHOD AND ETCHING SOLUTION FOR MANUFACTURING THE SAME
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Assignee
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| NO. 4 EAST SECOND ROAD, TONGZHOU INDUSTRIAL DEVELOPMENT ZONE |
| TONGZHOU DISTRICT, BEIJING, CHINA 101113 |
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Correspondence name and address
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HARNESS DICKEY (TROY)
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P.O. BOX 828
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BRYANT E. WADE
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BLOOMFIELD HILLS, MI 48303
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