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Reel/Frame:066103/0193   Pages: 3
Recorded: 01/11/2024
Attorney Dkt #:2021-4012/24061.4599US01
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 1
1
Patent #:
NONE
Issue Dt:
Application #:
17831714
Filing Dt:
06/03/2022
Publication #:
Pub Dt:
12/07/2023
Title:
Semiconductor Structures With Improved Reliability
Assignors
1
Exec Dt:
05/12/2022
2
Exec Dt:
06/13/2022
3
Exec Dt:
05/29/2022
Assignee
1
8, LI-HSIN RD. 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondence name and address
HAYNES AND BOONE LLP (24061) IP SECTION
2801 N. HARWOOD ST.
SUITE 2300
DALLAS, TX 75201

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