Patent Assignment Details
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| Reel/Frame: | 045736/0196 | |
| Pages: | 9 |
| | Recorded: | 05/07/2018 | | |
| Attorney Dkt #: | 25031US03 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/07/2019
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Application #:
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15973329
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Filing Dt:
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05/07/2018
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Title:
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SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
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Assignee
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| 2045 E. INNOVATION CIRCLE |
| TEMPE, ARIZONA 85284 |
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Correspondence name and address
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MCANDREWS, HELD & MALLOY, LTD.
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500 WEST MADISON ST., FLOOR 34
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CHICAGO, IL 60661
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