Patent Assignment Details
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Reel/Frame: | 006000/0197 | |
| Pages: | 2 |
| | Recorded: | 01/30/1992 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST. |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/07/1993
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Application #:
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07828033
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Filing Dt:
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01/30/1992
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Title:
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METHOD OF STRUCTURING A SEMICONDUCTOR CHIP
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Assignee
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A LIMITED LIABILITY COMPANY OF FED. REP. OF GERMANY |
POSTFACH 10 60 50 D-7000 STUTTGART 10 FED. REP. GERMANY |
GERMANY |
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Correspondence name and address
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FRISHAUF, HOLTZ, GOODMAN & WOODWARD
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600 THIRD AVE. - 30TH FLR.
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NEW YORK, NY 10016
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