Patent Assignment Details
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| Reel/Frame: | 008828/0198 | |
| Pages: | 3 |
| | Recorded: | 09/19/1997 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/26/1999
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Application #:
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08934315
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Filing Dt:
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09/19/1997
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Title:
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MOLD FOR BALL GRID ARRAY SEMICONDUCTOR PACKAGE
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Assignees
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| 280-8 SUNGSU 2-GA, SUNGDONG-KU |
| SEOUL, KOREA, REPUBLIC OF 133-2 |
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| SUITE 100 |
| 1347 N. ALMA SCHOOL ROAD |
| CHANDLER, ARIZONA 85224 |
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Correspondence name and address
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SKJERVEN, MORRILL, MACPHERSON, ET AL.
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ALAN H. MACPHERSON
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25 METRO DRIVE, SUITE 700
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SAN JOSE, CALIFORNIA 95110
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