Patent Assignment Details
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| Reel/Frame: | 063294/0198 | |
| Pages: | 5 |
| | Recorded: | 04/12/2023 | | |
| Attorney Dkt #: | 207-ZP22734851US |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/30/2024
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Application #:
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18298379
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Filing Dt:
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04/11/2023
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Title:
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WAFER-LEVEL HETEROGENEOUS DIES INTEGRATION STRUCTURE AND METHOD
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Assignee
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| ZHEJIANG LAB NANHU HEADQUARTERS, YUHANG DISTRICT |
| HANGZHOU, CHINA 311121 |
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Correspondence name and address
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CLIFFORD CHI, A.P.C.
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300 W VALLEY BLVD #609
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ALHAMBRA, CA 91803
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05/23/2024 11:25 PM
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