Patent Assignment Details
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| Reel/Frame: | 039481/0201 | |
| Pages: | 2 |
| | Recorded: | 08/19/2016 | | |
| Attorney Dkt #: | APACIC-07 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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09/25/2012
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Application #:
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12752345
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Filing Dt:
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04/01/2010
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Publication #:
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Pub Dt:
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08/04/2011
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Title:
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THREE-DIMENSIONAL SOC STRUCTURE FORMED BY STACKING MULTIPLE CHIP MODULES
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Assignee
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| 7F, NO. 26, PROSPERITY RD. 1, SCIENCE PARK |
| HSINCHU CITY, TAIWAN 300 |
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Correspondence name and address
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LIANG-HUNG LU
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P.O. BOX 90-3
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TAIPEI, 10699 TAIWAN
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