Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
| Reel/Frame: | 065021/0202 | |
| Pages: | 9 |
| | Recorded: | 09/21/2023 | | |
| Attorney Dkt #: | 1278.0007-7US |
| Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
|
|
Total properties:
1
|
|
|
|
Patent #:
|
|
Issue Dt:
|
06/06/2023
|
Application #:
|
17956239
|
Filing Dt:
|
09/29/2022
|
|
Title:
|
BUS PIPELINE STRUCTURE FOR DIE-TO-DIE INTERCONNECT AND CHIP
|
|
|
Assignee
|
|
|
|
|
| WORKSTATION 28, ROOM 415, 4/F, BLOCK A, ZHONGCHUANG SERVICE CENTRE, NO.1 XIHU ROAD |
| WUJIN NATIONAL HI-TECH INDUSTRIAL DEVELOPMENT ZONE, JIANGSU PROVINCE |
| CHANGZHOU, CHINA 213164 |
|
|
Correspondence name and address
|
| |
MARIAH WYSOCKI
|
| |
129 W. EVESHAM ROAD
|
| |
VOORHEES, NJ 08043
|
Search Results as of:
06/15/2024 06:38 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
