Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 025952/0205 | |
| Pages: | 4 |
| | Recorded: | 03/15/2011 | | |
| Attorney Dkt #: | 35497-US-PA |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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13043476
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Filing Dt:
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03/09/2011
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Publication #:
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Pub Dt:
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06/28/2012
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Title:
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WAFER SPLITTING APPARATUS AND WAFER SPLITTING PROCESS
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Assignee
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| NO.3, GONGYE E. 3RD RD., HSINCHU SCIENCE PARK, |
| HSINCHU, TAIWAN 30075 |
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Correspondence name and address
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JIANQ CHYUN INTELLECTUAL PROPERTY
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7F.-1, NO.100, ROOSEVELT RD., SEC. 2,
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TAIPEI, 100 TAIWAN
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