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Patent Assignment Details
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Reel/Frame:050194/0206   Pages: 6
Recorded: 08/28/2019
Attorney Dkt #:100100.360082
Conveyance: ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Total properties: 2
1
Patent #:
Issue Dt:
03/04/2014
Application #:
13647052
Filing Dt:
10/08/2012
Publication #:
Pub Dt:
02/07/2013
Title:
ROUTING LAYER FOR MITIGATING STRESS IN A SEMICONDUCTOR DIE
2
Patent #:
Issue Dt:
05/19/2015
Application #:
14188732
Filing Dt:
02/25/2014
Publication #:
Pub Dt:
06/19/2014
Title:
ROUTING LAYER FOR MITIGATING STRESS IN A SEMICONDUCTOR DIE
Assignors
1
Exec Dt:
06/14/2011
2
Exec Dt:
06/14/2011
Assignee
1
ONE COMMERCE VALLEY DRIVE EAST
MARKHAM, ONTARIO, CANADA L3T 7X6
Correspondence name and address
CHRISTOPHER J. RECKAMP
311 S. WACKER DRIVE
FAEGRE BAKER DANIELS LLP
CHICAGO, IL 60606

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