Patent Assignment Details
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| Reel/Frame: | 031072/0207 | |
| Pages: | 4 |
| | Recorded: | 08/23/2013 | | |
| Attorney Dkt #: | 5900/0378PUS1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/17/2015
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Application #:
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13968797
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Filing Dt:
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08/16/2013
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Publication #:
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Pub Dt:
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09/11/2014
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Title:
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STRUCTURE OF A SEMICONDUCTOR CHIP WITH SUBSTRATE VIA HOLES AND METAL BUMPS AND A FABRICATION METHOD THEREOF
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Assignee
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| NO. 69, TECHNOLOGY 7TH RD. |
| HWAYA TECHNOLOGY PARK, KUEI SHAN HSIANG |
| TAO YUAN SHIEN, TAIWAN |
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Correspondence name and address
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JOE MCKINNEY MUNCY
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4000 LEGATO ROAD
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SUITE 310
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FAIRFAX, VA 22033
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