Patent Assignment Details
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Reel/Frame: | 015931/0208 | |
| Pages: | 4 |
| | Recorded: | 04/22/2005 | | |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
6
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Patent #:
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Issue Dt:
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12/14/1999
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Application #:
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08968981
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Filing Dt:
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11/12/1997
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Title:
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NEW MULTIPLE CHIP MODULE CONFIGURATION TO SIMPLIFY TESTING PROCESS AND REUSE OF KNOWN-GOOD CHIP-SIZE PACKAGE (CSP)
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Patent #:
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Issue Dt:
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04/09/2002
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Application #:
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09229139
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Filing Dt:
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01/12/1999
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Publication #:
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Pub Dt:
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12/06/2001
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Title:
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SOLDER BALLS AND COLUMNS WITH STRATIFIED UNDERFILLS ON SUBSTRATE FOR FLIP CHIP JOINING
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Patent #:
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Issue Dt:
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10/09/2001
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Application #:
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09287218
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Filing Dt:
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04/05/1999
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Title:
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DIRECT-CHIP-ATTACH (DCA) MULTIPLE CHIP MODULE (MCM) WITH REPAIR-CHIP READY SITE T0 SIMPLIFY ASSEMBLING AND TESTING PROCESS
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Patent #:
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Issue Dt:
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07/25/2000
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Application #:
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09313562
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Filing Dt:
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05/15/1999
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Title:
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FACE-TO-FACE (FTF) STACKED ASSEMBLY OF SUBSTRATE-ON-BARE-CHIP (SOBC) MODULES
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Patent #:
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Issue Dt:
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06/19/2001
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Application #:
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09314493
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Filing Dt:
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05/18/1999
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Title:
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SUBSTRATE ON CHIP (SOC) MULTIPLE-CHIP MODULE (MCM) WITH CHIP-SIZE-PACKAGE (CSP) READY CONFIGURATION
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Patent #:
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Issue Dt:
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01/13/2004
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Application #:
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09727913
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Filing Dt:
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11/28/2000
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Title:
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PROCESS FLOW AND CONFIGURATION OF MULTIPLE CHIP MODULE(MCM) MANUFACTURED WITH PRE-TESTED KNOWN GOOD SUBSTRATE(KGS)
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Assignee
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505 E. TRAVIS ST. |
SUITE 112 |
MARSHALL, TEXAS 75670 |
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Correspondence name and address
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LESLIE D. WARE
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1701 N. MARKET STREET
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SUITE 330
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DALLAS, TX 75202
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