Patent Assignment Details
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| Reel/Frame: | 021550/0209 | |
| Pages: | 5 |
| | Recorded: | 09/18/2008 | | |
| Attorney Dkt #: | BRV-44155 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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01/12/2010
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Application #:
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12212302
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Filing Dt:
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09/17/2008
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Publication #:
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Pub Dt:
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03/19/2009
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Title:
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METHOD OF BONDING CHIPS ON A STRAINED SUBSTRATE AND METHOD OF PLACING UNDER STRAIN A SEMICONDUCTOR READING CIRCUIT
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Assignee
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| 25, RUE LEBLANC BATIMENT |
| "LE PONANT D" |
| PARIS, FRANCE 75015 |
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Correspondence name and address
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JEFFREY J. SOPKO / PEARNE & GORDON LLP
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1801 EAST 9TH STREET
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SUITE 1200
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CLEVELAND, OH 44114-3108
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