Patent Assignment Details
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| Reel/Frame: | 008825/0211 | |
| Pages: | 3 |
| | Recorded: | 09/29/1997 | | |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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04/27/1999
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Application #:
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08939394
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Filing Dt:
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09/29/1997
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Title:
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MICROELECTRONIC PACKAGES AND PACKAGING METHODS INCLUDING THERMALLY AND ELECTRICALLY CONDUCTIVE PAD
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Assignee
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| P.O. BOX 13969 |
| 7001 DEVELOPMENT DRIVE |
| RESEARCH TRIANGLE PARK, NORTH CAROLINA 27709 |
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Correspondence name and address
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MYERS, BIGEL SIBLEY & SAJOVEC, L.L.P.
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NEEDHAM J. BODDIE, II, ESQ.
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P.O. BOX 37428
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RALEIGH, NC 27627
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