Patent Assignment Details
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| Reel/Frame: | 012721/0211 | |
| Pages: | 6 |
| | Recorded: | 04/01/2002 | | |
| Conveyance: | RECORD TO CORRECT THE STATE OF INCORPORATION FOR THE ASSIGNEE IN THE ASSIGNMENT DOCUMENT PREVIOUSLY RECORDED ON REEL 9303, FRAME 0589. |
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Total properties:
1
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Patent #:
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Issue Dt:
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07/04/2000
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Application #:
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09107801
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Filing Dt:
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06/30/1998
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Title:
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CHIP-ON-CHIP INTEGRATED CIRCUIT PACKAGE AND METHOD FOR MAKING THE SAME
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Assignee
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| 2900 SEMICONDUCTOR DRIVE |
| SANTA CLARA, CALIFORNIA 95051 |
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Correspondence name and address
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BEYER WEAVER & THOMAS LLP
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STEVE D. BEYER
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P.O. BOX 778
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BERKELEY, CA 94704-0778
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