Patent Assignment Details
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| Reel/Frame: | 036104/0211 | |
| Pages: | 3 |
| | Recorded: | 07/15/2015 | | |
| Attorney Dkt #: | ETRP0134USA3 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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10/24/2017
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Application #:
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14800682
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Filing Dt:
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07/15/2015
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Publication #:
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Pub Dt:
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11/05/2015
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Title:
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RECONFIGURABLE HIGH SPEED MEMORY CHIP MODULE AND ELECTRONIC DEVICE WITH A RECONFIGURABLE HIGH SPEED MEMORY CHIP MODULE
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Assignee
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| NO. 6, TECHNOLOGY ROAD 5 |
| HSINCHU, TAIWAN |
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Correspondence name and address
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WINSTON HSU
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P.O.BOX 506
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MERRIFIELD, VA 22116
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