Patent Assignment Details
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Reel/Frame: | 045594/0214 | |
| Pages: | 5 |
| | Recorded: | 04/19/2018 | | |
Attorney Dkt #: | US72887 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/19/2020
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Application #:
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15957875
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Filing Dt:
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04/19/2018
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Publication #:
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Pub Dt:
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09/19/2019
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Title:
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METHOD OF MANUFACTURING MULTILAYER CIRCUIT BOARD
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Assignees
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NO.18,TENGFEI ROAD,ECONOMIC AND TECHNOLOGICAL DEVELOPMENT ZONE |
QINHUANGDAO, CHINA |
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XINYUAN INDUSTRIAL ZONE, TANGWEI VILLAGE,FUYONG TOWN, BAO AN DISTRICT |
SHENZHEN, CHINA |
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Correspondence name and address
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CALVIN H CHAI
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550 S. HOPE STREET, SUITE 2825
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LOS ANGELES, CA 90071
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