Patent Assignment Details
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Reel/Frame: | 031259/0215 | |
| Pages: | 4 |
| | Recorded: | 09/23/2013 | | |
Attorney Dkt #: | SP13-291 |
Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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11/07/2017
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Application #:
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14033883
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Filing Dt:
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09/23/2013
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Publication #:
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Pub Dt:
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03/26/2015
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Title:
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HONEYCOMB CERAMIC SUBSTRATES, HONEYCOMB EXTRUSION DIES, AND METHODS OF MAKING HONEYCOMB CERAMIC SUBSTRATES
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Assignee
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SP-TI-03-1 |
CORNING, NEW YORK 14831 |
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Correspondence name and address
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CORNING INCORPORATED
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SP-TI-3-1
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CORNING, NY 14831
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10/31/2024 08:09 PM
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