Patent Assignment Details
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 066704/0219 | |
| Pages: | 3 |
| | Recorded: | 03/08/2024 | | |
| Attorney Dkt #: | 030103.0010D1-D1C1-D1C1C1 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
3
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Patent #:
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Issue Dt:
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06/21/2022
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Application #:
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17097224
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Filing Dt:
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11/13/2020
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Publication #:
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Pub Dt:
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03/04/2021
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Title:
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SEMICONDUCTOR DEVICE HAVING DEEP TRENCH STRUCTURE AND METHOD OF MANUFACTURING THEREOF
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Patent #:
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Issue Dt:
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03/28/2023
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Application #:
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17741791
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Filing Dt:
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05/11/2022
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Publication #:
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Pub Dt:
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08/25/2022
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Title:
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SEMICONDUCTOR DEVICE HAVING DEEP TRENCH STRUCTURE AND METHOD OF MANUFACTURING THEREOF
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Patent #:
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NONE
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Issue Dt:
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Application #:
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18111079
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Filing Dt:
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02/17/2023
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Publication #:
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Pub Dt:
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06/29/2023
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Title:
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SEMICONDUCTOR DEVICE HAVING DEEP TRENCH STRUCTURE AND METHOD OF MANUFACTURING THEREOF
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Assignee
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| 215, DAESIN-RO, HEUNGDEOK-GU, CHUNGCHEONGBUK-DO |
| CHEONGJU-SI, KOREA, REPUBLIC OF 28429 |
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Correspondence name and address
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NSIP LAW
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P.O. BOX 65745
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WASHINGTON, DC 20035
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05/25/2024 02:00 AM
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