Patent Assignment Details
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For pending or abandoned applications please consult USPTO staff.
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| Reel/Frame: | 057745/0220 | |
| Pages: | 5 |
| | Recorded: | 10/08/2021 | | |
| Attorney Dkt #: | US85825 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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06/06/2023
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Application #:
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17497815
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Filing Dt:
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10/08/2021
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Publication #:
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Pub Dt:
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01/27/2022
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Title:
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METHOD OF MANUFACTURING COMPOSITE CIRCUIT BOARD
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Assignees
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| NO.18,TENGFEI ROAD,ECONOMIC AND TECHNOLOGICAL DEVELOPMENT ZONE |
| QINHUANGDAO, CHINA |
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| B1DG A1-A3, AVARY PARK, SONGLUO RD.,,YANCHUAN COMMUNITY, YANLUO ST., BAO AN DIST., |
| SHENZHEN, CHINA |
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Correspondence name and address
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TUNG-YUN MCNALLY
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550 S. HOPE STREET, SUITE 2825
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LOS ANGELES, CA 90071
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05/31/2024 09:57 AM
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