Patent Assignment Details
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| Reel/Frame: | 021543/0222 | |
| Pages: | 12 |
| | Recorded: | 09/17/2008 | | |
| Attorney Dkt #: | 3019186 |
| Conveyance: | ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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11847512
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Filing Dt:
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08/30/2007
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Publication #:
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Pub Dt:
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03/06/2008
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Title:
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RELIABLE WAFER-LEVEL CHIP-SCALE PACKAGE SOLDER BUMP STRUCTURE IN A PACKAGED SEMICONDUCTOR DEVICE
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Assignee
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| 82 RUNNING HILL ROAD |
| MS 35-4E |
| SOUTH PORTLAND, MAINE 04106 |
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Correspondence name and address
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THOMAS R. FITZGERALD, ESQ.
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HISCOCK & BARCLAY, LLP
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2000 HSBC PLAZA, 100 CHESTNUT ST.
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ROCHESTER, NY 14604-2404
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