Patent Assignment Details
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| Reel/Frame: | 025217/0222 | |
| Pages: | 2 |
| | Recorded: | 10/29/2010 | | |
| Attorney Dkt #: | 2000100 |
| Conveyance: | CHANGE OF NAME (SEE DOCUMENT FOR DETAILS). |
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Total properties:
1
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Patent #:
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Issue Dt:
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05/11/2004
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Application #:
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09902878
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Filing Dt:
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07/11/2001
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Publication #:
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Pub Dt:
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01/16/2003
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Title:
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ENHANCED THERMAL DISSIPATION INTEGRATED CIRCUIT PACKAGE AND METHOD OF MANUFACTURING ENHANCED THERMAL DISSIPATION INTEGRATED CIRCUIT PACKAGE
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Assignee
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| 28 FUI YIU KOK STREET |
| UNIT E, 9/F METEX HOUSE |
| TSUEN WAN, N.T., HONG KONG |
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Correspondence name and address
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MITCHELL M. WONG
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40 WALL STREET, FLOOR 28
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THE EXETER LAW GROUP LLP
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NEW YORK, NY 10005
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